| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor unit highly reliable at a high temperature. <P>SOLUTION: In this semiconductor unit, a semiconductor device and external terminals are joined via aluminum pads and golden wires; and at least the semiconductor device, the aluminum pads, and the golden wires are sealed with a resin composition. In this semiconductor unit, the thickness of the aluminum pad is ≥0.1 μm and ≤3 μm; the golden wire contains 0.001-1 wt% of Pd; and the total amount of atoms of boron, nitrogen, fluorine, sodium, chlorine, bromine, iodine, antimony, molybdenum and bismuth contained in the resin composition is ≤0.3 wt%. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
