| 摘要 |
<p>A device (10) for sticking films, which cuts a roll film (A) fed out by means of a film moving mechanism (20) into small pieces (A1) of film, conveys the small pieces (A1) of film by means of a head unit moving mechanism (30), and sticks the small pieces (A1) of film to a sheet-like electronic substrate (B) which is conveyed by means of a substrate moving mechanism (15). The device (10) is provided with head units (31a, 31b) which can move along Y rails (33a, 33b) of the head unit moving mechanism (30). The head units (31a, 31b) are respectively provided with four dies (36) which can move individually and vertically, and respectively provided with a die cutting edge (37), a suction port (38), and a fixing heater (39). Furthermore, the head unit (31a, 31b) is provided with a substrate detection unit (29), and a state detection section (42) is provided below the range in which the head unit (31a, 31b) moves.</p> |
