FLEXIBLE BARRIER FILM, METHOD OF FORMING SAME, AND ORGANIC ELECTRONIC DEVICE INCLUDING SAME
摘要
A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1 x 10-2 g/m2/day at 22 °C and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy- functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.
申请公布号
WO2010083236(A1)
申请公布日期
2010.07.22
申请号
WO2010US20923
申请日期
2010.01.13
申请人
DOW CORNING CORPORATION;BLIZZARD, JOHN, DONALD;TONGE, JAMES, STEVEN;WEIDNER, WILLIAM, KENNETH;QUADSIL, INC.