| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring circuit board in which a cover insulating layer can be precisely disposed for a conductor layer and the wiring circuit board can be obtained easily in a short time: and to provide a method for manufacturing the wiring circuit board. Ž<P>SOLUTION: The manufacturing method includes the steps of preparing a base insulating layer 2 and a conductor layer 3 formed on the layer 2 and equipped with a wiring circuit pattern 5 and an irradiated portion 6 independently from the pattern 5, and having surface roughness Rz of 1.0-20 μm in ten point average roughness conforming to JIS B 0601-1994; placing a double-layer sheet adhesive layer 10 made of an adhesive layer 10 and an insulating film 9 on the conductor layer 3; irradiating the irradiated portion 6 with a laser beam 13 to locally heat the adhesive layer 10 to temporarily press-fit the layer; and principally press-fitting it then to bond the insulating film 9 via the adhesive layer 10, thereby forming a cover insulating layer 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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