| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent storage of an IC module into storage recessed part of a card base material in a state that a releasing paper is left. <P>SOLUTION: An adhesive tape 14 is lapped on an LSI mounting face side of a supplied carrier tape 11 from an adhesive layer 18 side, the lapped adhesive tape 14 is pressed and heated to adhesively join the adhesive tape 14 through the adhesive layer 18, the releasing paper 16 of the joined adhesive tape 14 is released, it is distinguished by a distinction part 21 whether or not a part 16a of the releasing paper 16 is left in the IC module 2 after the release of the releasing paper 16, it is alarmed by an alarm part 29 that the left releasing paper has to be removed based on the distinction of that the part 16a of the releasing paper 16 is left by the distinction part 21, the IC module 2 wherein the releasing paper 16a is not left is individually stamped out from the carrier tape 11, and the stamped-out IC module 2 is stored in the storage recessed part of the card base material and is adhesively joined and fixed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
