| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit substrate with electric and electronic components incorporated therein which is thin relative to a conventional circuit substrate with a component incorporated therein, and capable of increasing the number of surface-mounted components. <P>SOLUTION: In this circuit substrate with electric and electronic components incorporated therein, the electric and electronic components 2 and an intermediate circuit substrate 3 having, in a surface thereof, a component penetration hole 7 allowing the electric and electronic components 2 to penetrate therein, and having a first land part 6A on the upper surface 3a and a second land part 6B on the undersurface 3b are embedded in an insulation base material 1 having a third land part 4A on the upper surface 1a and a fourth land part 4B on the undersurface 1b; and all the third land part 4A, the first land part 6A and the second land part 6B are electrically connected to the first land part 6A, the second land part 6B and the fourth land part 4B through plating material filled vias 9a, 8, 9b, respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT |
