发明名称 |
Memory module assembly with heat dissipation device |
摘要 |
A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.
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申请公布号 |
US7755897(B2) |
申请公布日期 |
2010.07.13 |
申请号 |
US20070964896 |
申请日期 |
2007.12.27 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
CHEN FEI;ZHAO DI-QIONG;FANG YI-CHYNG;WANG YUE-BIN |
分类号 |
H05K7/20;H01L23/36 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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