| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor device is provided to increase the efficiency of equipment use by performing an etching process for opening a pad part and a cleaning process for removing remaining foreign materials on the pad part. CONSTITUTION: A semiconductor substrate with a pad part for a wire bonding is loaded on a chamber(S200). The semiconductor substrate is unloaded after the pad part is open by an etching process(S202). A chamber is cleaned(S204). The semiconductor substrate with the open pad part is loaded on the chamber(S206). The semiconductor substrate is unloaded after the remaining foreign materials are removed on the open pad part by a plasma process(S208).</p> |
