| 摘要 |
PURPOSE: A system in package is provided to reduce manufacturing costs by easily changing the existing universal chips. CONSTITUTION: A system in package comprises a plurality of main chips(40) and a bus chip(30). A plurality of main chips is selected according to a selection signal and reads the stored data or stores the provided data. The bus chip generates the selection signal for selecting at least one chip among the main chips and exchanges data with the main chip. The main chips are universal chips. The pad of the main chips is wire-bonded with the pad of the bus chip. |
