发明名称 LIGHT-EMITTING DEVICE, LIGHT EMITTING MODULE, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To suppress not only deterioration of efficiency in extracting light emitted from a light emitting element but also temperature rise of the light emitting element associated with light emission thereof. <P>SOLUTION: A light emitting chip 22 includes: a container 30 with a concave portion 31; a first lead portion 61 to a fourth lead portion 64 disposed so as to expose to the concave portion 31; and a first blue LED to a fourth blue LED 74 which are mounted on the first lead portion 61 to the fourth lead portion 64 exposed to the concave portion 31. The container 30 includes: a first container portion 40 configured to cover a region where the first lead portion 61 to the fourth lead portion 64 are not exposed in the concave portion 31; and a second container portion 50 that are in contact with the first lead portion 61 to the fourth lead portion 64 without being exposed to the concave portion 31 for housing the first container portion 40. In the container 30, the first container portion 40 includes a material whose light reflectivity is higher than that of the second container portion 50, and the second container 50 includes the material whose thermal conductivity is higher than that of the first container 40. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010153666(A) 申请公布日期 2010.07.08
申请号 JP20080331579 申请日期 2008.12.25
申请人 SHOWA DENKO KK 发明人 TAKEI TOMOYUKI;MIKI HISAYUKI
分类号 H01L33/48 主分类号 H01L33/48
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