发明名称 LENS PROTECTED CHIP LED PACKAGE
摘要 <p>PURPOSE: A lens protection optical device package is provided to prevent the damage of the lens by manufacturing a lens with a height lower than the top surface, so that the lens wouldn't be protruding to the outside of the optical element. CONSTITUTION: A first inner terminal and a second inner terminal are located on the base side of an accommodating groove(1). A light emitting diode chip is located on the first inner terminal. A first external terminal(3) electrically connected to the first inner terminal on the outside of a white resin(2). A second external terminal(13) is electrically connected to the second inner terminal. A lens is manufactured to have the height lower than the package upper side.</p>
申请公布号 KR20100076825(A) 申请公布日期 2010.07.06
申请号 KR20080135003 申请日期 2008.12.26
申请人 KIM, MIN KONG;YOON, MIN SUP 发明人 YOON, MIN SUP;KIM, MIN KONG
分类号 H01L33/48 主分类号 H01L33/48
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