发明名称 |
FLEXIBLE PRINTED WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board having high adhesion with an anisotropic conductive film and capable of sufficiently securing the mechanical joint and electrical joint with an electronic component when mounting the electronic component using the anisotropic conductive film. SOLUTION: The wiring board has a structure in which a conductive wire 2 is provided on the surface of an insulating layer 1 having flexibility. The 10-point average roughness Rz stipulated by JIS B0601-1994 on the surface of the insulating layer 1 exposed to the surface on which the conductive wire 2 is formed of a flexible printed wiring board A is in the range of 0.8 to 2.0μm. By adjusting the surface roughness of the insulating layer 1 as described above, the adhesion between the surface of the insulating layer 1 and an anisotropic conductive film 3 is improved. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010147442(A) |
申请公布日期 |
2010.07.01 |
申请号 |
JP20080326515 |
申请日期 |
2008.12.22 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
SHIMIZU HIROMI;TAKAHASHI HIROAKI;KOYAMA MASAYA;YAMAMOTO MANABU |
分类号 |
H05K1/02;H05K3/00;H05K3/32 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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