发明名称 FLEXIBLE PRINTED WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board having high adhesion with an anisotropic conductive film and capable of sufficiently securing the mechanical joint and electrical joint with an electronic component when mounting the electronic component using the anisotropic conductive film. SOLUTION: The wiring board has a structure in which a conductive wire 2 is provided on the surface of an insulating layer 1 having flexibility. The 10-point average roughness Rz stipulated by JIS B0601-1994 on the surface of the insulating layer 1 exposed to the surface on which the conductive wire 2 is formed of a flexible printed wiring board A is in the range of 0.8 to 2.0μm. By adjusting the surface roughness of the insulating layer 1 as described above, the adhesion between the surface of the insulating layer 1 and an anisotropic conductive film 3 is improved. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147442(A) 申请公布日期 2010.07.01
申请号 JP20080326515 申请日期 2008.12.22
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 SHIMIZU HIROMI;TAKAHASHI HIROAKI;KOYAMA MASAYA;YAMAMOTO MANABU
分类号 H05K1/02;H05K3/00;H05K3/32 主分类号 H05K1/02
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