| 摘要 |
PURPOSE: A grinding pad for chemical mechanical polishing is provided to increase a service life of a grinding pad by removing bubble using grooves. CONSTITUTION: A grinding pad for chemical mechanical polishing comprises an upper pad(310) and a bottom pad(320). Grooves(330) are formed in the upper side of the upper pad to the constant interval. The bottom pad is bonded with the lower-part of the upper pad. A hole is formed on the lower-part of the bottom pad at a fixed interval. When the pad is connected to the platen, the groove prevents bubbles. |
