| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device for improving light output. <P>SOLUTION: An LED chip 10 is packaged on a packaging substrate 40 so that an LED thin-film section 2 is closer to the packaging substrate 40 than a transparent pyramid 3 in a hexagonal weight shape. In the packaging substrate 40, chip electrode connection sections 45a, 44a to which cathode and anode electrodes 5, 4 of the LED chip 10 are connected each project from a mesa section 42 provided on a tip surface 42a. The shape of the mesa section 42 is set to be similar to the transparent pyramid 3 of the LED chip 10, while the mesa section 42 is within a virtual pyramid 70 formed by extending six slopes 33 of the transparent pyramid 3 onto one surface of the packaging substrate 40, whereas the shape of a dome-shaped color conversion member 50 is set so that an inner-periphery line 53a of an edge 53 at one surface side of the packaging substrate 40 is not outside an outer-periphery line 71a of a lower surface 71 of the virtual pyramid 70. <P>COPYRIGHT: (C)2010,JPO&INPIT |
