| 发明名称 |
THERMOSETTING MODIFIED POLYAMIDE RESIN COMPOSITION |
| 摘要 |
<p>The modified polyamide resin composition contains a modified polyamide resin, into which soft segments made of polybutadiene segments or polycarbonate segments are introduced, and a guanamine resin. When the modified polyamide resin composition is thermally treated, a cured film with excellent electric insulating properties, heat resistance, and flexibility as well as improved surface hardness, tackiness, and warping can be obtained.</p> |
| 申请公布号 |
WO2010071107(A1) |
申请公布日期 |
2010.06.24 |
| 申请号 |
WO2009JP70825 |
申请日期 |
2009.12.14 |
| 申请人 |
UBE INDUSTRIES, LTD.;TAKAHASHI, KEITA;MURAKAMI, TOORU;IKEGAMI, OSAMU;TAKASAWA, RYOICHI |
发明人 |
TAKAHASHI, KEITA;MURAKAMI, TOORU;IKEGAMI, OSAMU;TAKASAWA, RYOICHI |
| 分类号 |
C08L79/08;C08G18/60;C08G18/69;C08G59/50;C08G81/00;C08L61/26;C08L63/00;H01B3/30 |
主分类号 |
C08L79/08 |
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