发明名称 Positive resist composition, positive resist composition for thermal flow, and resist pattern forming method
摘要 Disclosed is a positive resist composition comprising a resin component (A) and an acid generator component (B), wherein the component (A) contains a polymer compound (A1) containing a structural unit (a0) represented by formula (a0) shown below and a structural unit (a2) derived from an acrylate ester containing a lactone-containing cyclic group: (wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group, or a halogenated lower alkyl group; Y1 represents an aliphatic cyclic group; Z represents an acid dissociable, dissolution inhibiting group containing a tertiary alkyl group; a represents an integer from 1 to 3, b represents an integer from 0 to 2, and a+b=1 to 3; and c, d and e each represents, independently, an integer from 0 to 3).
申请公布号 US7741008(B2) 申请公布日期 2010.06.22
申请号 US20060089681 申请日期 2006.10.17
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 FURUYA SANAE;HADA HIDEO;NAKAGAWA YUSUKE;YAMAZAKI AKIYOSHI
分类号 G03F7/004;G03F7/30 主分类号 G03F7/004
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