| 摘要 |
PURPOSE: A semiconductor package of stacked chips having an improved data bus structure is provided to efficiently transmit data by supplying an optimum data bus structure according to a bank, a bank group, and a rank. CONSTITUTION: A master chip(111) communicates with an external memory controller. A slave chip(112) is laminated on more than one master chip. The slave chip communicates with the master chip through more than one conductive part. A plurality of chips comprises a plurality of memory banks. A plurality of chips communicate with the same master chip and include more than one first memory bank and a second memory bank which are divided into different ranks(rank0,rank1). |
