发明名称 |
Verfahren zur Herstellung eines keramischen elektronischen Mehrschichtbauteils |
摘要 |
A method of production of a multilayer ceramic electronic device having dielectric layers with an interlayer thickness of 5 µm or less and internal electrode layers including a base metal, including the steps of firing, then annealing a stack comprised of a dielectric layer paste and an internal electrode layer paste including a base metal alternately arranged in 100 layers or more under a reducing atmosphere, treating the annealed stack by first heat treatment under a strong reducing atmosphere of an oxygen partial pressure P3 of over 2.9 x 10 -39 Pa to less than 6.7 x 10 -24 Pa at a holding temperature T3 of over 300°C to less than 600°C. The stack after the first heat treatment is treated by second heat treatment under an atmosphere of an oxygen partial pressure P4 of over 1.9 x 10 -7 Pa to less than 4.1 x 10 -3 Pa at a holding temperature T4 of over 500°C to less than 1000°C. |
申请公布号 |
DE602006014042(D1) |
申请公布日期 |
2010.06.17 |
申请号 |
DE20066014042T |
申请日期 |
2006.03.24 |
申请人 |
TDK CORP. |
发明人 |
FUKUI, TAKASHI;UEDA, KANAME;KON, SHINTARO;SATO, ARATA;SATO, AKIRA |
分类号 |
H01G4/12;C04B35/00;C04B35/468;H01G4/30;H01G13/00 |
主分类号 |
H01G4/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|