METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method of manufacturing a printed circuit board is provided to bury a minute circuit pattern in an insulating layer by processing a releasing layer through a roughening treatment. CONSTITUTION: In a method of manufacturing a printed circuit board, a carrier having a releasing layer therein is provided(S110). The releasing layer is processed through a roughening treatment so that it has surface roughness(S120). A circuit pattern is formed on the releasing layer(S140). The carrier is laminated on the insulating layer(S150). The circuit pattern is buried in the insulating layer. The releasing layer and the carrier are separated from the insulating layer and the circuit pattern(S160).