METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to form a via without a photolithography process or a laser drilling. CONSTITUTION: A curing resin(10) is formed on top of a first conductive layer. A via hole is formed on the curing resin by using a mold. The mold comprises a pattern. A conductive via(11a) is formed by forming a plating layer on the first conductive layer. The via hole is filled with the conductive via. A second conductive layer is laminated on the top side of the curing resin and the conductive via. The first conductive layer and the second conductive layer are patterned.