| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is stably manufactured in response to high speed operation and high density. <P>SOLUTION: The semiconductor device 1 includes a wiring board 8 having a mounting surface 8a on which a semiconductor chip 2 is laminated and mounted and a plurality of the semiconductor chips 2 mounted on the mounting surface 8a of the wiring board 8. The plurality of semiconductor chips 2 mounted on the mounting surface 8a of the wiring board 8 includes a second semiconductor chip 2b mounted so that a circuit forming surface 3 is faced toward the mounting surface 8a of the wiring board 8 and a first semiconductor chip 2a mounted so that the circuit forming surface 3 is faced opposite to the mounting surface 8a of the wiring board 8. <P>COPYRIGHT: (C)2010,JPO&INPIT |
