| 摘要 |
PROBLEM TO BE SOLVED: To keep a cutting means and a body to be pasted in a non-contact state when an adhesive sheet is cut and pasted. SOLUTION: This sheet pasting device 10 includes a delivery means 12 for supporting the band-like adhesive sheet, a cutting means 14 which provides a closed loop-like slit C in the adhesive sheet S and forms a sheet S1 for pasting on the inside of the slit C and an unnecessary sheet S2 on the outside of the slit C, and a pressing means 16 for pasting the sheet S1 for pasting on a ring frame RF and a semiconductor wafer W. The cutting means 14 is provided so that the slit C can be formed in the adhesive sheet S when the adhesive sheet S is brought into contact with the pressing means 16. After the slit C is formed, the sheet S1 for pasting is pasted on the ring frame RF and the semiconductor wafer W by the pressing means 16. COPYRIGHT: (C)2010,JPO&INPIT
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