发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To obtain a method of manufacturing a semiconductor device, wherein a single crystal silicon layer having a small number of crystal defects and high crystallinity is formed on an insulating film; and to provide the semiconductor device. Ž<P>SOLUTION: The method of manufacturing the semiconductor device 101 has a step of forming the insulating film 2 on one side 1a of a substrate 1, a step of forming a hole 2c exposing the substrate 1 by opening the insulating film 2, a step of forming a crystal growth assisting film 3 so as to cover the inner wall surface of the hole 2c, a step of forming a noncrystal silicon layer so as to fill the hole 2c and to cover the side 2a opposite to the substrate of the insulating film 2, and a step of changing the noncrystal silicon layer to a single-crystal silicon layer 5 by a laser annealing method. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010129963(A) 申请公布日期 2010.06.10
申请号 JP20080306353 申请日期 2008.12.01
申请人 ELPIDA MEMORY INC 发明人 FUJIMOTO HIROYUKI;FUJIKASHI YUUKI
分类号 H01L21/20;H01L21/02;H01L21/336;H01L21/76;H01L21/762;H01L21/8234;H01L21/8242;H01L27/00;H01L27/08;H01L27/088;H01L27/10;H01L27/108;H01L27/12;H01L27/146;H01L29/78;H01L29/786 主分类号 H01L21/20
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