SUBSTRATE FOR MOUNTING DEVICE, METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve reliability of connection between a bump electrode and a device electrode in a semiconductor module having a structure that the bump electrode formed on a wiring layer is connected to the device electrode formed on a semiconductor device.

SOLUTION: An insulating resin layer 40 is formed between the semiconductor device 20 and the wiring layer 50. The bump electrode 60 formed integrally with the wiring layer 50 and protruded from the wiring layer 50 to the insulating resin layer 40 side is electrically connected to the device electrode formed on the semiconductor device 20. The height of a part of the wiring layer 50 on the end side of a protrusion connection area 52 is lower than the height of the wiring layer 50 in a wiring area 54 extended to the opposite side of the end side.

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