| 摘要 |
PROBLEM TO BE SOLVED: To provide an additive for a resin enhancing heat-resistance of the resin by enhancing a thermal decomposition temperature when in use of the resin or in molding processing and having no odor generation hetero element such as sulfur, and to provide a polymerizable composition containing the additive for the resin, and a resin composition. SOLUTION: The additive for the resin contains a compound represented by formula (1) (wherein R<SP>1</SP>is allyl, aralkyl and alkyl; R<SP>2</SP>is hydrogen or methyl; X and Y may be the same or different and are each hydrogen, alkyl, halogen, hydroxyl and alkoxy). COPYRIGHT: (C)2010,JPO&INPIT
|
