| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method for a wafer capable of preventing the quality of processing on the wafer from becoming worse without sticking any sticking matter on the wafer. SOLUTION: A dividing method for the wafer wherein the wafer which has a plurality of cutting schedule lines formed in a lattice shape on a top surface and also has a device formed in each of a plurality of regions defined by the plurality of cutting schedule lines is cut along the cutting schedule lines and divided into individual chips includes a protective member arranging step of arranging a protective member made of silicon on the top surface of the wafer, a wafer supporting step of supporting the reverse surface of the wafer by a wafer supporting means, a wafer holding step of sucking and holding the wafer supported by the wafer supporting means by a chuck table, a dividing step of cutting the wafer sucked and held by the chuck table along the cutting schedule lines together with the protective member and dividing the wafer into the individual chips, and a protective member removing step of removing the protective member from the top surface of the wafer after the dividing step. COPYRIGHT: (C)2010,JPO&INPIT
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