| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamideimide resin-based heat-resistant resin composition which is excellent in heat resistance, adhesiveness and processability after being cured at a high temperature of ≥350°C, and to provide a coating material or the like, using the composition as a coating film component. Ž<P>SOLUTION: The heat-resistant resin composition contains, as essential components, (A) a polyamideimide resin obtained by reacting a diisocyanate compound or a diamine compound and a tribasic acid anhydride or a tribasic acid anhydride chloride in a basic polar solvent and (B) an anti-aging agent. The coating material includes the heat-resistant resin composition as a coating film component. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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