| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of shortening a development time, and reducing design cost. <P>SOLUTION: The semiconductor device 10 includes a substrate 12, and a wiring pattern is formed on the surface of the substrate 12. The wiring pattern includes electrodes 18a, WB pads 18b, and connecting parts 18c. The WB pad 18b is formed so that the longitudinal direction Q is substantially in parallel with a line P which extends radially from the center X of a DB region 28. Therefore, when a chip 16 of a first size is bonded in the DB region, bonding wires 24 are substantially in parallel with the longitudinal direction Q. Furthermore, even if a chip 16 having a second size smaller than the first size and the same shape as the first size chip 16 is bonded, the bonding wires 24 are substantially in parallel with the longitudinal direction Q. Since the same substrate 12 can be used regardless of the chip size, it is not necessary to prepare a plurality of wiring patterns according to chip sizes. Therefore, the time for developing the wiring pattern can be shortened. <P>COPYRIGHT: (C)2010,JPO&INPIT |
