| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of connection failure by electrically connecting a probe terminal and a bump of a semiconductor chip with highly precise alignment and at a constant and sufficient pressing force. SOLUTION: In a probe card 10, at a back surface side of a print circuit board 11, an area, in which a probe terminal of a probe sheet 13 is formed, is stretched flatly by a wafer pressing plate 32 of a base unit 12 that is fixed to the print circuit board 11, and an end side of the probe sheet 13 is pressure-bonded to the back surface of the print circuit board 11 by a pressure-bonding sheet plate 14 via a rubber sheet 15 so that a connecting terminal of the print circuit board 11 and a sheet connecting terminal of the probe sheet 13 are electrically connected. The base unit 12 provides a pressing force acting on the semiconductor chip side from the wafer pressing plate 32 when a bump of a semiconductor chip to be tested is pressed onto the probe terminal of the probe sheet 13. COPYRIGHT: (C)2010,JPO&INPIT
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