| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board that secures connection reliability between a semiconductor package and a wiring substrate, and to provide electronic equipment. <P>SOLUTION: The printed circuit board 5 has a BGA (Ball Grid Array) 50 having a plurality of solder balls 53 on one surface, a BGA-mounted substrate 51 which has electrodes at positions corresponding to the solder balls 53 respectively and on which the BGA 50 is mounted, and a reinforcing member 52 which is formed continuously around the BGA 50 while partially having an opening 520, and to which the BGA 50 and BGA-mounted substrate 51 are fixed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
