| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide base metal powder whose reaction with an acidic functional group in a resin is suppressed, to provide a resin composition in which gelling is suppressed using the base metal powder, to provide a method for producing base metal powder, to produce a method for producing a resin composition, and to provide a method for producing a circuit board and a method for producing a ceramic multilayer board using the resin composition. <P>SOLUTION: A resin composition containing base metal powder and resin having an acidic functional group is produced and with the use of the resin composition, the circuit board and ceramic multilayer board are produced, wherein the inside of the base metal powder is a base metal and the surface thereof is coated with: a coating treatment film composed of a substance which is not a basic base metal compound, is not reacted with the acidic functional group, and does not substantially dissolve in an organic solvent; and an oxide film of the base metal. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
