METHOD AND APPARATUS FOR FORMING CONDUCTIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a conductive film capable of forming a conductive film having a desired resistibility and a uniform composition in a substrate surface. SOLUTION: The method for forming the conductive film comprising a conductive compound with a composition containing a plurality of metal elements includes repeatedly performing the sputtering to a first target containing two or more metal elements among the plurality of metal elements and the sputtering to a second target containing one metal element among the plurality of metal elements by using a film-forming apparatus 10 capable of using a plurality of targets 1 to 4. COPYRIGHT: (C)2010,JPO&INPIT