发明名称 MASKING MATERIAL, AND PRINTING METHOD OF SOLDER PASTE AND FORMING METHOD OF SOLDER BUMP BY USING MASKING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a masking material raising the accuracy of a masking pattern by preventing a droop due to heating, increasing the transfer quantity of solder paste, and ensuring excellent detergency after heating curing, and also to provide a printing method of solder paste using the masking material. SOLUTION: The masking material is used for printing solder paste on electrodes formed on a board, and contains a vehicle used for the solder paste, and an inorganic powder. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010114330(A) 申请公布日期 2010.05.20
申请号 JP20080287162 申请日期 2008.11.07
申请人 TAMURA SEISAKUSHO CO LTD 发明人 SASAKI KOHEI;HAYASHIDA YOSHITAKA;ANDO HARUHIKO;SAKAMOTO ISAO;SHIRAI MASARU;HIRATSUKA ATSUSHI;SAITO KOJI;FURUNO MASAHIKO
分类号 H05K3/34;B23K3/06;B23K101/42;B41M1/12;H05K3/28 主分类号 H05K3/34
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