METHOD FOR SELF-ARRANGING OF SOLDER BALLS FOR PACKAGING AND SOLDERING USING THE SAME

摘要

PURPOSE: A method for self-arranging of solder balls for packaging and soldering using the same are provided to mount a solder ball without using an apparatus for absorbing the solder ball by arranging the solder ball through self-alignment using droplet attached on the substrate surface. CONSTITUTION: A substrate surface is selectively processed to be hydrophilic(S1). A liquid droplet is formed on the substrate surface(S2). The solder ball is self-aligned in the liquid droplet(S3). The solder ball is reflowed and is attached on the substrate(S4). A top chip and the substrate is contacted with each other through the solder ball(S5). The solder ball is reflowed final and the substrate and the top chip are bonded with each other(S6).