发明名称 IMAGING MODULE AND PROCESS OF FABRICATING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide the imaging module which can decrease the parts count. <P>SOLUTION: The imaging module 1 includes an imaging substrate 3 carrying image sensors 2, a lens 4 supported on a holder 5, and a shield member 6 which is fixed to the opening of the holder 5 and forms an inner space S for containing the imaging substrate 3, wherein the imaging substrate 3 is fixed to protrusions 6a which are arranged, continuously in the direction of the optical axis, at least two positions in the inner space S while holding the imaging substrate 3 therebetween. Since the imaging substrate 3 can be positioned and fixed easily and no extra member is required for fixing the imaging substrate 3 to the holder 5, the structural components of the imaging module 1 can be decreased. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010109550(A) 申请公布日期 2010.05.13
申请号 JP20080278128 申请日期 2008.10.29
申请人 KYOCERA CORP 发明人 NAKAO HIROSHI
分类号 H04N5/225;G02B7/02;H04N5/335;H04N5/372;H04N5/374 主分类号 H04N5/225
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