发明名称 |
MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS |
摘要 |
The present invention is directed to a method of packaging multiple semiconductor chips on a second semiconductor chips with a built-in efficient cooling means. One embodiment is to place two multiple chip stacks on opposing sides of a vapor chamber for transferring heat away from the semiconductor chips. Another embodiment is to construct a vapor chamber with a substrate such that at least one multiple chip stack is embedded inside the vapor chamber.
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申请公布号 |
US2010117209(A1) |
申请公布日期 |
2010.05.13 |
申请号 |
US20070680311 |
申请日期 |
2007.02.28 |
申请人 |
BEZAMA RASCHID J;LU MINHUA;MOK LAWRENCE S |
发明人 |
BEZAMA RASCHID J.;LU MINHUA;MOK LAWRENCE S. |
分类号 |
H01L23/52;H01L23/46 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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