SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package simplified in a process by eliminating the need to separately form vias for electrically connecting both sides of a semiconductor substrate to each other, and capable of reducing manufacturing cost and improving connection reliability; and to provide a method of manufacturing the same.

SOLUTION: The semiconductor package includes: a semiconductor substrate having one surface on which a conductive pad is formed; an insulating layer formed on the one surface of the semiconductor substrate; a metal post penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit electrically connected to the metal post.

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