| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material and a method for forming an excellent electrode pattern causing no blister in a resist heat-hardening process after the exposure of a resist layer, causing no peeling of metallic foil from a glass paste layer in a resist pattern forming process and a metallic foil etching process, and causing no lift of the electrode pattern in a baking process after forming the electrode pattern of metallic foil, in forming an electrode using metallic foil. Ž<P>SOLUTION: This transfer film for forming the metal pattern is formed by laminating (A) the resist layer, (B) a metal layer, and (C) the glass paste layer in this order on a support film. The glass paste layer (C) has the thickness of 5-30 μm, and is formed of (C') glass paste containing (a) glass powder, (b) binding resin whose glass transition point is -30 to 30°C, and (c) a solvent, wherein the content of the solvent (c) in the glass paste layer (C) is 1 wt.% or less. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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