| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, the composition capable of effectively suppressing contamination on a mold surface in continuous molding, and to provide a semiconductor device fabricated by sealing and molding a semiconductor element with the composition. Ž<P>SOLUTION: The epoxy resin composition for sealing the semiconductor contains an epoxy resin, a curing agent, an inorganic filler and a release agent, wherein the release agent contains a reaction product of palmitic acid and an amino group-containing polysiloxane. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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