| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging system which solves such the problem that physical forces sufficient to deform a packaging for the electronic device can damage the device, and some mechanical components in a device (for example, in a microelectromechanical device) and/or in an interferometric modulator are particularly susceptible to damage, and to provide a packaged electronic device that resists physical damage, a method for manufacturing the packaged electronic device, and a method for protecting the electronic device from physical damage. SOLUTION: The packaging system for the electronic device 700 includes one or more spacers 730 that prevent or reduce damage to the electronic device arising from contact with a back plate 750. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers. COPYRIGHT: (C)2010,JPO&INPIT
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