| 摘要 |
A method of sealing, by low-pressure injection of reactive resin, an electronic sensor placed in a housing consisting of at least two attached elements, includes the following steps: i. assembly of the sensor within the elements of the housing, ii. locking of the elements of the housing, in order to form an injection jacket, iii. low-pressure injection of a reactive resin through at least one filling orifice of the injection jacket, iv. continuing injection until the reactive resin overflows into at least one overflow container provided to contain the excess reactive resin, characterized in that filling orifice(s) and overflow container(s) are incorporated in the injection jacket.
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