发明名称 Circuit board with plating bar
摘要 A circuit board includes a pad, a transmitting trace and a plating bar. The plating bar is used for forming an electroplating metallic layer on the pad, the pad and the transmitting trace are used for the signal transmission. Due to the plating bar causes a noise during the signal transmission, a dielectric layer having at least one opening is adjacent to at least one side of the plating bar to reduce the equivalent dielectric permittivity thereof and to maintain signal transmitting quality.
申请公布号 US7709745(B2) 申请公布日期 2010.05.04
申请号 US20060396633 申请日期 2006.04.04
申请人 VIA TECHNOLOGIES, INC. 发明人 LEE SHENG-YUAN
分类号 H05K1/03 主分类号 H05K1/03
代理机构 代理人
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