MICROELECTRONIC STRUCTURE, MULTI-CHIP MODULE, MEMORY CARD INCLUDING THE SAME AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a microelectronic structure capable of effectively arranging via-electrodes, a multi-chip module, a memory card, and a method of manufacturing an integrated circuit element.

SOLUTION: The microelectronic structure includes: a substrate 110; a conductive pad 130 on the substrate and including first and second openings extending therethrough; a first conductive via electrode 150 on the conductive pad and extending through the first opening in the conductive pad into the substrate; and a second conductive via electrode 160 on the conductive pad adjacent the first conductive via electrode and extending through the second opening in the conductive pad into the substrate.

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