| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently reduce an installation space of a compression molding apparatus 1 for semiconductor chips as a whole, to efficiently decrease a mold clamping force of molds 5, 6 set up in the apparatus 1, and furthermore, to perform mold-clamping by efficiently being adjusted to thicknesses of substrates 2 when using the substrates 2 (2a, 2b) of different thicknesses. <P>SOLUTION: A mold opening and closing means 12 is installed in a compression molding device 1 for semiconductor chips for coupling mold surfaces of upper dies 5a, 6a and mold surfaces of lower dies 5b, 6b, respectively, of top and bottom positioned molds 5, 6 while the compression molding apparatus 1 for semiconductor chips is composed by stack-positioning two compression molding molds 5, 6 (top and bottom molds). The mold opening and closing means 12 is composed by installing a mold opening and closing mechanism 13 and a thickness adjusting mechanism 14 wherein the mold opening and closing mechanism has two racks 15, 16 and a pinion 17 and the thickness adjusting mechanism is adjusted corresponding to the thicknesses of the substrates 2 applied to the top and bottom positioned molds 5, 6. <P>COPYRIGHT: (C)2010,JPO&INPIT |
