| 摘要 |
PROBLEM TO BE SOLVED: To disclose and provide a novel technique for actualizing a function module including a sealing structure for a low-cost MEMS element with high reliability and, especially, to provide a novel MEMS module configured with the low-cost and high-reliable sealing structure physically integrated with a driving electronic circuit. SOLUTION: The MEMS module 1 comprises a multilayer printed circuit board 100 of at least one layer substrate 100a and the other layer substrate 100b. The MEMS element 101 is disposed at the one layer substrate 100a. An electric circuit element 106 for driving the MEMS element 101 is disposed at the other layer substrate 100b different from the one layer substrate 100a. A sealing space 101A for enclosing and sealing the MEMS element 101 is formed of at least a portion of the multilayer printed circuit board 100. COPYRIGHT: (C)2010,JPO&INPIT
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