| 摘要 |
PROBLEM TO BE SOLVED: To provide: a lead frame substrate having a built-in electronic component, which can suitably respond to an increase in the number of terminals of a semiconductor element when manufacturing the semiconductor device having the built-in electronic component using a lead frame and which has a high degree of freedom in arrangement of the component; a method for manufacturing the lead frame substrate; and a semiconductor device using the method. SOLUTION: The lead frame substrate includes: wiring on a first surface of a metal plate; connecting posts on a second surface of the metal plate; and a resin layer for pre-mold, having the electronic component embedded in the other areas. In the lead frame substrate, the electronic component is preferably not higher than the connecting posts in a mounting state. The semiconductor element is mounted on the lead frame substrate, and the semiconductor device has a configuration in which the substrate and the semiconductor elements are connected by wire bonding. COPYRIGHT: (C)2010,JPO&INPIT |
