| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component bonded structure capable of making an electronic component highly functional and increasing terminals, and the electronic component bonded structure. <P>SOLUTION: The manufacturing method of the electronic component bonded structure includes an application process of applying solder paste on an electrode metal on a substrate and a thermal treatment process of thermally treating the solder paste in the state of bringing the electrode terminal of the electronic component into contact through the solder paste on the electrode metal on the substrate. When the contact area of a metal plate and the solder paste in application to the metal plate of the same material as the electrode metal on the substrate is defined as A and the contact area of the metal plate and the solder after thermally treating the solder paste in the range of a temperature 235 to 260°C is defined as B, the solder paste satisfies 0.7≤B/A≤1.3. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
