| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress corrosion of a metal part, to suppress substrate contamination, to improve process quality and to improve yield. Ž<P>SOLUTION: A substrate processing apparatus comprises: a process chamber; a substrate holder; a cover part closing and opening the process chamber; a substrate holder stage; a rotary mechanism rotating the substrate holder stage; a rotation shaft inserted through the cover part and connected to the substrate holder stage and the rotary mechanism so that a first gas ejection port is formed therebetween; a first gas stagnant part surrounded by the rotary mechanism, the cover part, and the rotation shaft and connected to the process chamber via the first gas ejection port; a second gas ejection port formed at the substrate holder stage; a first gas stagnant part formed at the rotation shaft and communicating with the process chamber via the second gas ejection port; and a flow port formed at the rotation shaft for connecting the first and first gas stagnant parts. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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