| 摘要 |
A semiconductor device includes a MIM capacitor that includes an insulating film and a first electrode and a second electrode which are formed in the same layer in the insulating film and are facing to each other with the insulating film interposed therebetween. The first electrode and the second electrode respectively include a first high aspect via and a second high aspect via which extend as long as a length, in a stacked direction of the substrate, of a via and an interconnect provided on the via so as to be connected to the via formed in another region. A first potential and a second potential are respectively supplied to the first electrode and the second electrode.
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