发明名称 SELF-ASSEMBLY PROCESS FOR MEMORY ARRAY
摘要 <p>A method of making a device includes forming at least one anodizable metal layer over at least one of an electrode or a semiconductor device, forming a plurality of pores in the anodizable metal layer by anodization of the anodizable metal layer to expose a portion of the electrode or semiconductor device, and filling at least one pore with a rewritable material such that at least some of the rewritable material is in electrical contact with the electrode or semiconductor device.</p>
申请公布号 WO2010039568(A1) 申请公布日期 2010.04.08
申请号 WO2009US58151 申请日期 2009.09.24
申请人 SANDISK 3D LLC;XIAO, LI;ZHANG, JINGYAN;ZHONG, HUICAI 发明人 XIAO, LI;ZHANG, JINGYAN;ZHONG, HUICAI
分类号 H01L27/24;H01L27/102 主分类号 H01L27/24
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